One epoxy modified one component product
　　1 density ranging from 1.1 to 2.8, the curing time of 50 degrees /4 hours or 110 degrees /30 minutes or 110 degrees /50 minutes;
　　Thixotropic 2 with moderate, with complex on the circuit board of electronic components can be covered and wrapped, glue can be overcome, but not flowing, curing process is not running, keep the original shape;
　　3 cured black or amber light, relay and electronic components on the circuit board stick, and resistance to high temperature of 200-300 deg.c and strong acid corrosion and erosion resistance of various solvents;
　　4 high adhesive strength, good heat resistance, excellent solvent resistance, adhesion, high temperature can reach the device failure can also achieve the device damage, cured by professional solvent erosion, can make the circuit and electronic components to get favorable protection, prevent internal leakage device technology;
　　5 this product is suitable for encapsulating confidential electronic devices, after curing with strong solvent resistance, long-term immersion can withstand the organic solvent; the deformation temperature has a very high heat, can resist high temperature damage; at the same time has a hardness and excellent abrasion resistance, etching damage against common cutting tools.
　　6 use the potting electronic circuit, has excellent anti decryption.
　　7 this product is easy to use, long storage period, high bonding strength, fast curing rate, low shrinkage, non-toxic harmless and so on.
　　8 stored at room temperature for 70 days, more than half of the refrigerator storage.
　　Two epoxy modified two component products
　　Is a two-component heat cured potting material, it becomes a dense solid structure after curing, high hardness, good heat resistance, extremely difficult to remove, can play a role of protection, waterproof, confidentiality.
　　1 product features:
　　1） good adhesive strength, stable performance.
　　2） low viscosity, good fluidity, no air bubble, good toughness.
　　3） technology is good, can be cured at room temperature or heating, and the cure rate is fast, easy to operate.
　　2 use method: the product is divided into A, B two components, the ratio of A:B for the 100:40, the use of A, B two groups of accurate weighing, fully mixing into a uniform mixture, after filling the curing conditions were carried out.
　　3 curing conditions: 120 degrees /2 hours or 80 degrees /4-5 hours
　　4 after curing performance:
　　1） hardness: >80
　　2） volume resistance: 2.6 * 1015 -cm
　　3） surface resistance: 3.7 * 1013
　　Breakdown voltage: 25kv/mm
　　5） dielectric constant: 3.5@1KHz
　　6） dielectric loss: 0.02
　　Impact strength: >9.5kg/cm
　　8） bending strength: >900kg/cm
　　5 transportation and storage:
　　1） A, B two sets of copies are required in dry, cool place sealed to save;
　　2） preservation period for one year;
　　3） this product is not dangerous goods, can be kept and transported by general chemicals.